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Active Area Deposition Mask, High Density


Product Code E338-SPC
Price £200.00 ex. VAT

An evaporation mask for deposition onto the active area of a device, for use with Ossila's high-density OFET system.
Outer dimensions: 75 mm x 75 mm
Number of OFETs: 20 per substrate. 

Mask with direct contact (no spacer): For sputtering and other non-directional deposition systems, as well as for thermal deposition systems with oblique angles or a very short throw, we recommend the use of the direct contact mask to get well-defined edges.

Mask with 200 μm spacer: For normal thermal evaporation systems we recommend the use of masks with the 200 μm spacer to help avoid scratches and allow better out-gassing.

 

Datasheet

Size 75 mm x 75 mm
Thickness 2 mm (exc. bolts)
Material Stainless steel
Substrate capacity E338: 12 (S221, S223 or S403)
E339: 12 (S233, S411)
High density OFET active area evaporation mask (technical drawing)
Dimensioned diagrams of the high density linear OFET gate mask (substrate holder)

 

High density OFET active area evaporation mask (dimensions)
Dimensioned diagrams of the high density linear OFET gate mask (substrate mask)

 

High density interdigitated OFET active area evaporation mask (dimensions)
Dimensioned diagrams of the high density interdigitated OFET gate mask (substrate mask)

 

To the best of our knowledge, the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.

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