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Active Area Deposition Mask, High Density

Substrates and Fabrication


Product Code E338-SPC
Price $325 ex. VAT

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An evaporation mask for deposition onto the active area of a device, for use with Ossila's high-density OFET system.
Outer dimensions: 75 mm x 75 mm
Number of OFETs: 20 per substrate. 

Mask with direct contact (no spacer): For sputtering and other non-directional deposition systems, as well as for thermal deposition systems with oblique angles or a very short throw, we recommend the use of the direct contact mask to get well-defined edges.

Mask with 100 μm spacer: For normal thermal evaporation systems we recommend the use of masks with the 100 μm spacer to help avoid scratches and allow better out-gassing.

Datasheet

Size 75 mm x 75 mm
Thickness 1.7mm without spacer, 1.8mm with spacer (exc. bolts)
Material Stainless steel
Substrate capacity E338: 12 (S221, S223 or S403)
E339: 12 (S233, S411)
High density OFET active area evaporation mask (technical drawing)
Dimensioned diagrams of the high density linear OFET gate mask (substrate holder)

 

High density OFET active area evaporation mask (dimensions)
Dimensioned diagrams of the high density linear OFET gate mask (substrate mask)

 

High density interdigitated OFET active area evaporation mask (dimensions)
Dimensioned diagrams of the high density interdigitated OFET gate mask (substrate mask)

To the best of our knowledge the information provided here is accurate. The values provided are typical at the time of manufacture and may vary over time and from batch to batch. Products may have minor cosmetic differences (e.g. to the branding) compared to the photos on our website. All products are for laboratory and research and development use only.

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