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Product Code M2187A1-250mg
Price $400 ex. VAT

PPDN, ETL and HIL material in organic electronic devices

Paired with HATCN to improve device performance


PPDN has a chemical structure of phenanthroline in conjugation with dicarbonitrile-substituted pyrazine. As PPDN is electron-deficient, it can be used as an electron-transport layer (ETL) or hole-injection layer (HIL) material in organic electronic devices.

PPDN can be used as an additive to prevent HATCN crystallisation while it is solution processed. Films prepared from a mixture of PPDN and HATCN have been shown to have a transparent appearance. Furthermore, devices using HATCN and PPDN together showed a lower driving voltage and higher luminescence efficiency when compared to devices made using HATCN alone.

General Information


CAS number 215611-93-1
Full name Pyrazino[2,3-f][1,10]phenanthroline-2,3-dicarbonitrile
Chemical formula C16H6N6
Molecular weight 282.26 g/mol
Absorption λmax 307 nm in DCM
Fluorescence λmax 487 nm in DCM
HOMO/LUMO HOMO = 7.47 eV, LUMO = 3.41 eV (DFT)
Classification / Family Electron transport layer (ETL) materials, Hole injection layer (HIL) materials, Sublimed materials, Organic electronics.

Product Details


Purity Sublimed >99% (HPLC)
Melting point TGA: > 270 °C (0.5% weight loss)
Appearance White crystals/powder

Chemical Structure


ppdn 215611-93-1
Chemical structure of PPDN

Pricing


Grade Order Code Quantity Price
Sublimed (>99% purity) M2187A1 250 mg £320
Sublimed (>99% purity) M2187A1 500 mg £520
Sublimed (>99% purity) M2187A1 1 g £950

MSDS Documentation


PPDN MSDSPPDN MSDS sheet

Literature and Reviews


  1. Novel materials for fabrication and encapsulation of OLEDs, N. Kalyani et al., Renew. Sust. Energ. Rev., 44, 319–347 (2015); doi: 10.1016/j.rser.2014.11.070.
  2. Inhibition of solution-processed 1,4,5,8,9,11-hexaazatriphenylene-hexacarbonitrile crystallization by mixing additives for hole injection layers in organic light-emitting devices, S. Ohisa et al., Poly. J., 49, 149–154 (2017); doi: 10.1038/pj.2016.92.
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