Evaporation Stack for OFETs, Low Density
The evaporation stack holds the OFET source-drain shadow masks and substrates in close contact for thermal evaporation. This is crucial for effective device fabrication as the source-drain channel is usually the most critical feature on an OFET. For use with the Ossila low density OFET source-drain evaporation masks (sold separately).
The diagram below shows a deconstructed view of how the evaporation stack fits together. At the base of the system is the shadow mask support which prevents the thin and flexible shadow masks from warping. The shadow masks are then placed on top of the support. Above shadow mask the substrate support holds the substrates in alignment with the mask. The lid is used to bolt everything together into a mechanically stable system that can be mounted in a deposition system at any orientation. Finally, a low strength magnetic sheet is placed on top of the lid to pull the shadow mask in close contact with the substrates.
Shadow mask (sold separately)
Shadow mask support
|Size||75 mm x 75 mm|
|Thickness||1 mm (exc. bolts)|
PLEASE NOTE: The magnetic sheet should now be placed on top of the lid, so that it can be taken off while the substrates are still secure in the stack, thus avoiding damage to the substrates.
The follow video demonstrates how to put together the low density OFET evaporation stack using the low density OFET shadow mask and silicon substrates.
Please note that the shadow mask and the substrates featured in the video are used to demonstrate how the stack is used and are not included as part of it.
To the best of our knowledge, the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.