Silicon substrates designed for use in organic electronics labs as FET substrates, and other applications including X-ray studies, surface microscopy analysis and elipsometry measurements. Sold on 200 mm wafer mounts pre-oxidised and pre-diced to our standardised substrate size of 15 mm x 20 mm, which fits in our substrate rack and makes batch cleaning and processing much faster and simpler.
Please note that the current batch of wafers do not have a protective photoresist coating. With constant product development and improvement and for consistency and stability over long periods of time, we have had the latest batch produced without the photoresist. If you have any queries or concerns about this then please get in touch with the Ossila office as we will be happy to advise you.
|Product code||Oxide (nm)||Dicing||Resistivity (Ω cm)||Usage|
|S146||300||Diced||0.0005 to 0.001||
OFETs with a robust electro-mechanical gate insulator (suitable for use with gold electrode evaporations)
|S147||400||Diced||X-ray measurements, microscopy and ellipsometry|
|Wafer diameter||200 mm (8")|
|Oxide thickness and tolerance||+/- 5% (both sides)|
|Oxide growth||Thermally grown (dry)|
|Wafer type / dopant||P / Boron|
|Wafer thickness||725 +/- 25 µm|
|Wafer growth||Czochralski (CZ)|
|Orientation||<1 0 0>|
|Substrate size||20 mm x 15 mm|
|Substrates per wafer||Approx. 75 complete substrates (plus partial edge pieces)|
As with all organic electronic devices, getting a clean substrate is essential for high performance. Our pre-diced substrates make batch cleaning easier by use of a substrate rack. These wafers can be cleaned with the following routine:
- 5 mins sonication in 1% (v/v) Hellmanex solution
- 2x dump rinse in hot water
- 5 mins sonication in IPA
- 2x dump rinse in deionised water
- N2 blow dry
To the best of our knowledge the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.