Active Area Deposition Mask for Low Density OFETs

Order Code: E307
Price excludes taxes
Not in stock (price excludes taxes)

An evaporation mask for deposition of materials into the active area (source-drain channels). For use with the low density OFET system. A 200 μm standoff-spacer ensures that the mask does not touch the substrate while still enabling good deposition resolution.

Update: As part of our product improvement program, we have decided to simplify the masks available. Each type of mask is now available as a two-sided mask. On one side, a spacer and substrate holder are welded to the mask, and on the other side is just a substrate holder. This will make both options available for our customers to test out if they are uncertain which is best suited for their work. It also means that only a single mask needs to be purchased (instead of two) if you would like to use both systems.

Please note that the single-sided masks will only remain available while stocks last. However, if you are concerned that the double sided masks will be too thick for your evaporator, please do get in touch as we will be happy to help with this.



Low density active area evaporation mask (technical drawing)
Dimensioned diagram of the low density OFET active area mask


Low density OFET active area evaporation mask (dimensions)
Zoomed-in dimensioned diagram of the low density OFET active area mask.


Low density active area evaporation mask (photo)
Optical image of the low density OFET active area mask.


To the best of our knowledge the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.