FREE shipping to on qualifying orders when you spend or more, processed by Ossila BV. All prices ex. VAT. Qualifying orders ship free worldwide! Fast, secure, and backed by the Ossila guarantee. It looks like you are visiting from , click to shop in or change country. Orders to the EU are processed by our EU subsidiary.

It looks like you are using an unsupported browser. You can still place orders by emailing us on info@ossila.com, but you may experience issues browsing our website. Please consider upgrading to a modern browser for better security and an improved browsing experience.


Product Code C181
Price £64 ex. VAT

Coverslips, also known as Encapsulation Glass Slides, are part of the encapsulation system used with our OLED/OPV ITO patterned substrates.

They provide robust protection for manual handling of a completed device and prevent direct oxygen/water ingress, allowing for storage and measurement under ambient conditions for several weeks (edge ingress will eventually occur).

Encapsulation glass slides

Specifications


Coverslips for 20mm x 15mm Substrates

Encapsulation glass for 20mm x 15mm substrates
Encapsulation glass for 20mm x 15mm substrates.
Product Code C181
Size 12 mm x 15 mm
Thickness 0.55 mm
Material Float glass
Applicable substrates S211, S111

Coverslips for 25mm x 25mm Substrates

Encapsulation glass for 25mm x 25mm substrates
Encapsulation glass for 25mm x 25mm substrates.
Product Code C2010A1
Size 17 mm x 25 mm
Thickness 0.55 mm
Material Float glass
Applicable substrates S2006B, S2006C

Coverslips for 75mm x 25mm Substrates

Encapsulation glass for 75mm x 25mm substrates
Encapsulation glass for 75mm x 25mm substrates.
Product Code C182
Size 17 mm x 75 mm
Thickness 0.55 mm
Material Float glass
Applicable substrates S241, S251, S281

The glass coverlips are designed to be used with our Encapsulation Epoxy (E132) to encapsulate completed LED/PV devices in order to prevent damage to the active pixels, as is demonstrated in the schematic below.

Substrate encapsulations schematic
Schematic of substrate encapsulation.
Return to the top