A shadow mask for deposition of cathodes (or anodes) to define the active area onto Ossila's pixelated cathode substrates (S171). Two designs available on a double-sided mask, both with and without a 200 μm spacer.
Mask with direct contact: For sputtering and other non-directional deposition systems, as well as for thermal deposition systems with oblique angles or a very short throw, we recommend the use of the direct contact mask to get well-defined edges.
Mask with 200 μm spacer: For normal thermal evaporation systems we recommend the use of masks with the 200 μm spacer to help avoid scratches and allow better out-gassing.
Use: Substrates prepared with OPV/OLED inks are laid with the active face down into each of the twelve device holders, so that the shadow mask openings look onto the surface on which the cathode is to be deposited. The mask can then be transferred to an evaporator ready for deposition.
Edge pixels: Please note that the two pixels closest to the edge of the substrates are liable to edge effects when using spin coated organic layers (but not with thermally evaporated materials). The edge pixels will also be more quickly susceptible to oxygen/water ingress, which can be of benefit for separating out intrinsic/extrinsic lifetime effects, but can also lead to poorer performance for these two pixels when used with less stable materials or cathodes (such as calcium).
||75 mm x 75 mm
||12 substrates (S171)
To the best of our knowledge, the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.