Prefabricated OFET Test Chips, Low-Density
We use silicon/silicon oxide substrates with thermally evaporated gold electrodes. Our standard prefabricated substrates are supplied in batches of ten and fabricated using our Low Density OFET system; see schematics below for details.
The prefabricated low-density OFET test chips are recommended for the testing of multiple experimental parameters, such as the choice of semiconductor, concentration and deposition methods and conditions. When you require the collection of statistical data, the high-density OFET test chips are recommended.
The low-density test chips are compatible with Ossila's OFET Test Board for Low-Density OFETs (E222) to make mobility screening quick and simple.
A surface passivation treatment is recommended in order to achieve the best results with these bottom-contact, bottom-gate devices. There is a surface treatment procedure detailed in the User Manual for your convenience.
All devices are made to order, so the lead time is up to 2 weeks for standard devices. We can also fabricate the patterns onto other substrate materials for your individual research requirements, so please contact us to discuss your needs.
If you are uncertain about which range of specifications best suits your needs, please contact us to speak to one of our technical support team.
|30, 40, 50, 60, 80 µm
Constant channel length design
Variable channel length design
To the best of our knowledge the information provided here is accurate. The values provided are typical at the time of manufacture and may vary over time and from batch to batch. Products may have minor cosmetic differences (e.g. to the branding) compared to the photos on our website. All products are for laboratory and research and development use only.