The evaporation stack holds the OFET source-drain shadow masks and substrates in close contact for thermal evaporation. This is crucial for effective device fabrication as the source-drain channel is usually the most critical feature on an OFET. For use with the Ossila long channel OFET source-drain evaporation masks (sold separately).
A mechanical support system for use with Ossila's shadow masks to make evaporation of the source and drain contacts for Organic Field-Effect Transistors (OFETs) as simple and quick as possible. The Organic Field-Effect Transistors (OFETs) evaporation stack consists of a mask support which holds the flexible shadow masks in place. A substrate holder that holds up to 12 substrates aligned with the shadow mask. A weakly magnetic sheet ensures that the thin bars of the shadow mask which define the channel is held in close contact with the substrate. Finally a lid bolts everything together for a mechanically stable system for use in a variety of evaporation system in any orientation. Suitable for use in high vacuum equipment (tested to <10-6 mbar).
Holds the substrates and magnetic sheet in position
Pulls the shadow mask into contact with the substrate - even upside down
Up to twelve substrates per mask (sold separately)
Holds and aligns the substrates in position above the shadow mask
Interchangeable shadow masks with varying designs. Six OFETs per substrate
Provides mechanical support to the thin and flexible shadow masks.
Designed for use with Ossila standard sized substrates and with interchangeable shadow masks (substrates and shadow masks sold separately). The top gate shadow mask is also available.
|Outer dimensions||75 mm x 75 mm|
|Number of OFETs||72 (12 standard sized Ossila substrates with 6 OFETs each)|
|Compatible masks||E201, E211 and E261. Custom masks available upon request|
OFET geometries available with the Ossila OFET fabrication system
OFET Source-drain evaporation stack components
The lower support provides mechanical stability to the thin and flexible shadow mask
The shadow masks (interchangeable and sold separately) are then placed upon the lower support.
The substrate alignment plate is placed over the shadow mask.
Substrates are then loaded.
The weakly magnetic sheet is used to pull the shadow mask into contact with the substrates such that evaporation can be done in any orientation, even upside down.
The lid then bolts everything in place for a mechanically stable system.
Ossila OFET Source-drain evaporation stack demonstration video
Mask Dimensions (mm)
To the best of our knowledge the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.