Multiplexor for Mobility Testing and Sensing (High Density Substrates)

Order Code: E572


(excluding Taxes)


The Ossila multiplexor (high density substrates) allows the researchers to quickly and easily characterize a large number of devices without the need of arranging probe or manual switches. The multiplexer is ideally suited for statistically analysis of the device performance, including lifetime and environmental degradation testing. It is compatible with the high density Ossila evaporation system (E321-E329) and the high density prefabricated test chips (S221-S228).

The two BNC back connectors allows easy integration with the majority of the SMU models available on the market, while the NI USB Card make it easily programmable with a variety of languages such as LabVIEW, Matlab or C. Mobility characterization software is available on request.

If you require more information or technical questions about the Ossila multiplexor (high density substrates), or would like to discuss your personalised quote please contact us.


System overview

HD OFET multiplexor (front panel)HD OFET multiplexor (open)


Simply insert a substrate into the clip-fit bracket and start the test program to automatically characterize up to twenty devices with the OSSILA FACT software (contact Ossila for information on the control software and compatible SMUs).

High density interdigitated OFET  High density linear channel OFET
Bottom-gate bottom-contact Si/SiO2 substrates: inter-digitated OFET channels (left); linear channel design (right).


Turn-key systems also available

Fully integrated turn-key mobility measurement systems complete with source-measure unit and control computer/software are also available to give your lab a one-stop measurement solution.

Compatible systems

High Density OFET Fabrication System

Designed for maximum experimental versatility and ease of handling. Intended for use by scientists wanting to perform a wide variety of experiments on new types of devices. Also good for teaching and training purposes.



Prefabricated Substrates

Prefabricated substrates to make testing materials quick and simple and get the highest possible mobilities from new materials. Thermally evaporated gold or platinum electrodes on a silicon substrate with 300 nm silicon oxide gate dielectric. Optional OTS treatment makes device fabrication a one step process of spinning on your semiconductor. Fabricated to order for your research needs.

High density linear channel OFET prefabricated test chip


To the best of our knowledge the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.