Ossila's vacuum deposition masks have been specifically designed for our standardized 6-pixel substrates which are used for the fabrication of light-emitting diodes (LEDs) and photovoltaic devices. At Ossila, we offer a range of masks for sale which can be used in a variety of different applications. These include the deposition of electrodes of varying sizes for the screening of new materials, masks for the deposition of semiconducting active/interfacial materials, and masks for the deposition of our 6-pixel design. All masks are made from stainless steel with the option of an additional spacer layer. More information on the general specifications of the masks can be found below. The following masks are suitable for use with our S101 substrate design:
- Small area electrode masks - For the deposition of small area electrodes for defining devices with an active area of 0.45mm2
- Standard electrode masks - Defines two electrode stripes that overlap with the predeposited ITO to form 6 individual pixels per substrate with an active area of 4.5mm2
- Reduced resistance electrode masks - Defines a single large electrode strip that overlaps the predopsited ITO to form 6 individual pixels with active areas of 4.5mm2
- Active material masks - For the deposition of semiconducting material onto individual electrodes
- TCO deposition masks - For deposition of transparent conducting films with the exact dimensions of our S101 design, is compatible with our ultra flat quartz, and silicon oxide.
Each mask has the option of the addition of a 200 µm spacer layer that can be placed between the mask and the substrate. This spacer layer reduces the direct contact between the surface of the substrate and the mask by over 98%. This is recommended for samples that are easily scratched or for porous samples that experience a large amount of out-gassing.
For sputtering or other non-directional deposition techniques, the spacer layer is not recommended as the presence of a spacer layer will reduce the precision of your deposited edge.
Deposition Mask Specifications and Designs
|Outer Dimensions||75mm x 75mm|
|Recess Dimensions||20.3mm x 15.3mm|
|Thickness||1.9mm without spacer, 2.1mm with spacer|
Small Area Electrode Mask
Ossila's small area electrode mask has been designed for use with the most advanced materials where small defects in deposited layers can significantly impact device performance and characterization. By limiting the active area of the device, the probability of a defect being present within the device stack is reduced, allowing you to truly determine a material's maximum possible performance. Each individual pixel has an active area of 0.45mm2. The deposition pattern is shown to the right overlaid onto our S101 substrate.
The schematic drawing of our small area electrode mask can be seen below:
Standard Electrode Mask
Ossila's standard electrode mask is our first and most popular pre-patterned electrode design, two electrode strips of 3mm width are used to complete 3 device stacks each producing a total of 6 individual pixels per substrate with a total active area of 4.5mm2. The deposition pattern is shown to the right overlaid onto our S101 substrate.
The schematic drawing of our standard electrode mask can be seen below:
Reduce Resistance Electrode Mask
Ossila's reduced resistance mask is a modified version of our standard electrode design, where a single electrode strip is used to define all 6 pixels. The advantage of using a wider strip for the electrode is that the reduction in sheet resistance within the film allows for small increases in the maximum achievable performance of devices. The active area of each pixel is the same as the standard electrode at 4.5mm2. The deposition pattern is shown to the right overlaid onto our S101 substrate.
The schematic drawing of our reduced resistance electrode mask can be seen below:
Active Material Mask
Ossila's active area deposition mask is used for depositing material directly where the pixels for each device are going to be. This mask is suited for the deposition of both interfacial layers and the active material being studied with the device, in addition this mask is compatible with all three electrode deposition masks. By limiting the area of deposition of interfacial and active materials the encapsulation of devices can be made more effective, this is due to the reduction in transport via interfaces between layers. The deposition pattern is shown to the right overlaid onto our S101 substrate.
The schematic drawing of our active area mask can be seen below:
TCO Deposition Mask
Ossila's transparent conducting oxide (TCO) deposition mask can be used to deposit additional layers on top of our pre-patterned S101 6-pixel substrates. In addition, this mask can be used to deposit the 6-pixel design onto other substrates -- such as our ultra flat quartz substrates, or silicon oxide substrates if you wish to fabricate devices using your own TCO layers. The deposition pattern is shown to the right overlaid onto our ultra flat quartz substrate.
To the best of our knowledge, the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.