FREE shipping to on qualifying orders when you spend or more. All prices ex. VAT.
Join the Team About Ossila Contact Us |Log In Create Account| Worldwide Flag

Silicon Oxide Substrates and Wafers

Silicon substrates from diced wafer with 300 nm oxide
Product Code S146
Price $525.00 ex. VAT
$ USD

Silicon substrates designed for use in organic electronics labs as FET substrates, and other applications including X-ray studies, surface microscopy analysis and elipsometry measurements. Sold on 200 mm wafer mounts, pre-oxidised and pre-diced to our standardised substrate size of 15 mm x 20 mm with no photoresist coating, these substrates fit in our substrate rack and makes batch cleaning and processing much faster and simpler.

Product code Oxide (nm) Dicing Resistivity (Ω cm) Usage
S146 300 Diced <0.02 OFETs with a robust electro-mechanical gate insulator (suitable for use with gold electrode evaporations)
S147 400 Diced <0.02 X-ray measurements, microscopy and ellipsometry
S148 90 Diced <0.02 Optical microscopy of 2D materials
Silicon oxide individual substrate
Individual silicon oxide substrate (300 nm oxide).
Silicon oxide substrates wafer - 8 inch (200 mm) diameter
Wafer of diced silicon substrates (300 nm oxide).

Wafer Specifications

Wafer diameter 200 mm (8")
Oxide thickness tolerance +/- 5% (both sides)
Oxide growth Thermally grown (dry) on both sides
Wafer type / dopant P / Boron
Wafer thickness 725 +/- 25 µm
Wafer growth Czochralski (CZ)
Orientation <1 0 0>
Front surface Polished
Back surface Unpolished

Dicing Specifications

Substrate size 20 mm x 15 mm
Substrates per wafer Approx. 75 complete substrates (plus partial edge pieces)
Wafer protection None

Cleaning routine

As with all organic electronic devices, getting a clean substrate is essential for high performance. Our pre-diced substrates make batch cleaning easier by use of a substrate rack. These wafers can be cleaned with the following routine:

  • 5 mins sonication in 1% (v/v) Hellmanex solution
  • 2x dump rinse in hot water
  • 5 mins sonication in IPA
  • 2x dump rinse in deionised water
  • N2 blow dry

To the best of our knowledge the information provided here is accurate. However, Ossila assume no liability for the accuracy of this page. The values provided are typical at the time of manufacture and may vary over time and from batch to batch. All products are for laboratory and research and development use only, and may not be used for any other purpose including health care, pharmaceuticals, cosmetics, food or commercial applications.

Return to the top