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Active Area Deposition Mask, Low Density

Substrates and Fabrication


Product Code E307-SPC
Price £260 ex. VAT

An evaporation mask for deposition of materials into the active area (source-drain channels). For use with the low density OFET system. A 100 μm standoff-spacer ensures that the mask does not touch the substrate while still enabling good deposition resolution.

Mask with direct contact: For sputtering and other non-directional deposition systems, as well as for thermal deposition systems with oblique angles or a very short throw, we recommend the use of the direct contact mask to get well-defined edges.

Mask with 100 μm spacer: For normal thermal evaporation systems we recommend the use of masks with the 100 μm spacer to help avoid scratches and allow better out-gassing.

Datasheet

Low density active area evaporation mask (technical drawing)
Dimensioned diagram of the low density OFET active area mask

 

Low density OFET active area evaporation mask (dimensions)
Zoomed-in dimensioned diagram of the low density OFET active area mask.

 

Low density active area evaporation mask (photo)
Optical image of the low density OFET active area mask.
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