Dip Coater in Development
Posted on Wed, May 30, 2018 by Jon Griffin
Over the past year, we've been paying close attention to what our customers really want - and the majority of you have requested a wider range of coating equipment! As such, following on from the popular Ossila Slot-Die Coater, our team of engineers have been working hard to develop our next piece of thin-film coating equipment – the Ossila Dip Coater.
Dip coating is one of the most popular methods in scientific research for coating substrates with thin layers of material. The advantage of dip coating is that it is capable of coating all sides of a substrate at the same time. It can also be used in various applications - ranging from semiconductors, self-assembled monolayers, layer-by-layer nano assemblies, biomedical coatings, sol-gel coatings, and many more.
Dip coating relies upon the steady withdrawal of a substrate from solution. The meniscus that forms at the interface (and how it interacts with the substrate, air, and solution) will determine the thickness and film structure after drying. With dip coating, the film thickness can be controlled simply by changing the withdrawal speed and solution properties (such as solvent evaporation rates and solid content of the solution).
The Ossila Dip Coater has nearly completed its first stage of prototyping, where we have taken it from a simple idea on paper and developed a full computer model of the prospective system. This was then developed into a working prototype that was evaluated by our applications scientists, engineers, and safety experts to determine if any additional changes should be made to the system. This initial model has been moved into our laboratory to rigorously test the system's performance under various circumstances. We are also making coatings of our most commonly-used materials to test the system's real-world applications.
With its easy-to-use software, the Ossila Dip Coater gives you control of the immersion speed, dwell time, withdrawal speed (both fixed and variable across the substrates length), drying time, and number of cycles. Additionally, its precision linear stage allows you to have speeds from as low as 1mm/min to as high as 3000mm/min, offering a wide range of potential thicknesses for your deposited material - whilst maintaining a high degree of precision and accuracy.*
Over the next few months, we hope to release more information on the theory and technical aspects of dip coating, as well as information on the final specifications and price. The Ossila Dip Coater is scheduled for release in Q3 of 2018. For more information on the initial specifications or any other questions, please feel free to contact us at firstname.lastname@example.org.
Author: Jon Griffin
Jonathan joined Ossila in July 2016 after working as a post-doctoral research associate at the University of Sheffield. During his career as a research scientist, he has worked in a wide range of areas including organic light-emitting diodes, organic photovoltaics, transparent conductors, organic lead-halide perovskites, and scale-up processes in thin-film fabrication. As part of his role at Ossila, Jonathan is responsible for the technical support for several material ranges, including perovskites, organic photovoltaics, graphene and other 2-D materials. In addition, he is also involved in the development of new equipment and product ranges.