Silicon Oxide OFET Substrates



S102 OFET Substrate Silicon substrates designed for use in organic electronics labs as OFET substrates, as well as for a number of other applications including X-ray and elipsometry measurements. Sold on 200 mm wafer mounts and available pre-oxidised and pre-diced to our standardised substrate size of 15 mm x 20 mm, which fits in our substrate rack and makes batch cleaning and processing much faster and simpler.


Order codeQuantityPrice
S143 1 £199
S144 1 £299
S141 1 £249
S145 1 £249
S146 1 £349




Order codeOxide (nm)DicingResistivity (ohm cm)Usage
S143 None* Undiced 0.0005 to 0.001 Ellipsometry and X-ray measurements
S144 None* Diced 0.0005 to 0.001 Ellipsometry and X-ray measurements
S141 100 nm Diced 1 to 30 OFETs with lower threshold voltage (not suitable for use with gold)
S145 300 nm Undiced 0.0005 to 0.001 OFETs with a robust electro-mechanical gate insulator (suitable for use with gold)
S146 300 nm Diced 0.0005 to 0.001 OFETs with a robust electro-mechanical gate insulator (suitable for use with gold)




Other products you may be interested in...

OFET Shadow mask
OFET Source/drain evaporation stack
Topgate shadow mask
OFET Shadow mask
OFET Source/drain evaporation stack
Topgate shadow mask


Datasheet Adobe PDF


Si02 OFET Substrate OFET Wafer
Individual Substrate
Wafer of substrates

Wafer Specifications


Wafer diameter: 200 mmm (8")
Oxide thickness tolerance: +/- 5% (both sides)
Wafer Type/Dopant: P/Boron
Resistivity: 0.0005 ~ 0.001 ohm.cm
1-30 ohm cm
Thickness: 725 +/-25um
Growth:CZ
Orientation: <100>
Front surface: Polished
Back surface: Etched

Dicing Specifications (S144 & S146)

Substrate Size: 20mm x 15mm
Substrates per wafer:~75 complete substrates (plus partial edge pieces)
Wafer Protection:Thick photoresist (S144 and S146 only)


Cleaning routine

As with all organic electronic devices, getting a clean substrate is essential for high performance. Our pre-diced substrates make batch cleaning easier by use of a substrate rack and wafers S144 and S146 have also been coated with a thick photoresist prior to dicing to ensure wafer cleanliness. These wafers can be cleaned with the following routine:


• 5 mins sonication in acetone
• 5 mins sonication in fresh acetone
• 5 mins sonication in IPA
• N2 blow dry








Search
Loading
Ossila Orders

Simply phone, fax or email your purchase order to us

All prices subject to VAT where applicable

Shipping and Returns

Terms and conditions apply

If applicable, please provide your VAT registration number when placing an order