OFET Source/Drain Evaporation Stack

An integrated system for the fabrication of Organic Field-Effect Transistors (OFETs). Designed for use with Ossila standard sized substrates and with interchangeable shadow masks. Substrates and shadow masks sold separately.

Order code	Quantity	Price
E191	1	£249

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OFET Shadow mask	SiO2 OFET substrates	Top gate shadow mask

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Datasheet

A mechanical support system for use with Ossila's shadow masks to make evaporation of the source and drain contacts for Organic Field-Effect Transistors (OFETs) as simple and quick as possible. The Organic Field-Effect Transistors (OFETs) evaporation stack consists of a mask support which holds the flexible shadow masks in place. A substrate holder that holds up to 12 substrates aligned with the shadow mask. A weakly magnetic sheet ensures that the thin bars of the shadow mask which define the channel is held in close contact with the substrate. Finally a lid bolts everything together for a mechanically stable system for use in a variety of evaporation system in any orientation. Suitable for use in high vacuum equipment (tested to <10-6 mbar).

Designed for use with Ossila standard sized substrates and with interchangeable shadow masks (substrates and shadow masks sold separately). The Top gate shadow mask is also available.

Outer dimensions:	75 mm x 75 mm
Number of OFETs:	72 (12 standard sized Ossila substrates with 6 OFETs each).
Compatible masks:	E201, E211 and E261. Custom masks available upon request.

OFET geometries available with the Ossila OFET fabrication system.

Schematic of bottom gate, bottom contact OFETs using Ossila's source drain evaporation stack and Si/SiO2 substrates (top) and ITO substrates (bottom).

Schematic of bottom gate, top contact OFETs using Ossila's source drain evaporation stack and Si/SiO2 substrates (top) and ITO substrates (bottom).

OFET Source/drain evaporation stack components


Mask support	Interchangeable shadow masks (sold separately)	Substrate holder	Magnetic sheet	Lid

Loading procedure

Stage 1
The lower support provides mechanical stability to the thin and flexible shadow mask.

Stage 2
The shadow masks (interchangeable and sold separately) are then placed upon the lower support.

Stage 3
The substrate alignment plate is placed over the shadow mask.

Stage 4
Substrates are then loaded.

Stage 5
The weakly magnetic sheet is used to pull the shadow mask into contact with the substrates such that evaporation can be done in any orientation, even upside down.

Stage 6
The lid then bolts everything in place for a mechanically stable system.

Ossila OFET Source/drain evaporation stack demonstration video

Mask dimensions (mm)

Lower Support

Substrate Support

Lid

To the best of our knowledge the technical information provided here is accurate. However, Ossila assume no liability for the accuracy of this information. The values provided here are typical at the time of manufacture and may vary over time and from batch to batch.